hlmp-rl20, hlmp-sl20 precision optical performance amber new 4mm superwide oval led data sheet description the precision optical performance oval led is speci?cally designed for variable message signs and passenger infor- mation signs. the oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide ?eld of view outdoor applications where a wide viewing angle and readability in sunlight are essential. features well de?ned spatial radiation pattern high brightness material available in amber C amber alingap 590nm superior resistance to moisture typical viewing angle 60 x 120 stando? package applications variable message signs commercial outdoor advertising notes: all dimensions in millimeters (inches). 6.2 0.25 0.244 0.010 3.9 0.25 0.154 0.010 9.9 0.5 0.39 0.02 1.0 0.04 typ. 0.5 0.02 typ. 2.54 0.100 nom. 1.4 0.055 typ. 1.0 0.039 min. 25.4 1.0 min. cathode lead 3.0 0.25 0.118 0.010 package dimensions package drawing a package drawing b 6.3 0.25 0.248 0.010 4 0.25 0.157 0.010 9.9 0.5 0.39 0.020 0.5 0.02 typ. 2.54 0.100 nom. 1.4 0.055 typ. 1.0 0.04 min. 25.4 1.0 min. cathode lead 4 0.25 0.157 0.010 1.2 0.047 typ.
2 part numbering system device selection guide part number color and dominant wavelength d (nm) typ luminous intensity iv (mcd) at 20 ma-min luminous intensity iv (mcd) at 20 ma-max package drawing hlmp-rl20-mp0dd amber 590 520 1150 a hlmp-sl20-mp0dd amber 590 520 1150 b tolerance for each intensity limit is 15%. notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. 2. the optical axis is closely aligned with the package mechanical axis. note: please refer to ab 5337 for complete information about part numbering system. packaging option dd: ammo pack 00 : bulk color bin selection 0: full color bin distribution maximum intensity bin refer to intensity bin limit table minimum intensity bin refer to intensity bin limit table color l: amber 590 package r: 4mm oval 60 x 120, parallel s: 4mm oval 60 x 120, perpendicular hlmp C x x 20 C x x x xx
3 electrical / optical characteristics t a = 25c parameter symbol min. typ. max. units test conditions forward voltage v f 1.80 2.02 2.40 v i f = 20 ma reverse voltage v r 5vi r = 100 a dominant wavelength [1] d 584.5 594.5 nm i f = 20 ma peak wavelength peak 594 nm peak of wavelength of spectral distribution at i f = 20 ma thermal resistance r j-pin 240 c/w led junction-to-cathode lead luminous e?cacy [2] amber v 480 lm/w emitted luminous flux/emitted radiant flux luminous flux v 500 mlm i f = 20 ma luminous e?ciency [3] e 12 lm/w emitted luminous flux/electrical power i f = 20 ma notes: 1. the dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp. 2. the radiant intensity, i e in watts per steradian, may be found from the equation ie = i v / v where i v is the luminous intensity in candelas and v is the luminous e?cacy in lumens/watt. 3. e = v / i f x v f , where v is the emitted luminous ?ux, i f is electrical forward current and v f is the forward voltage. absolute maximum ratings t a = 25c parameter amber unit dc forward current [1] 50 ma peak forward current [2] 100 ma average forward current 30 ma reverse voltage (i r = 100 a) 5 v led junction temperature 130 c operating temperature range -40 to +100 c storage temperature range -40 to +100 c notes: 1. derate linearly as shown in figure 4. 2. duty factor 30%, frequency 1khz.
4 figure 1. relative intensity vs wavelength figure 2. forward current vs forward voltage figure 3. relative intensity vs forward current f igure 4. maximum forward current vs ambient temperature figure 5. representative radiation pattern C major axis figure 6. representative radiation pattern C minor axis t a - ambient temperature - c i f - forward current - ma 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 500 550 600 650 700 wavelength - nm relative intensity 0 10 20 30 40 50 0123 forward voltage - v forward current - ma 0 5 10 15 20 25 30 35 40 45 50 55 0 20 40 60 80 100 120 0 0.5 1 1.5 2 0 1020304050 dc forward current - ma relative luminous intensity (normalized at 20 ma) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity
5 intensity bin limit table bin name min. max. m 520 680 n 680 880 p 880 1150 q 1150 1500 tolerance for each bin limit is 15% color bin limit bin id min. max. 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 tolerance for each bin limit is 1.0 nm
6 precautions: lead forming: the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: care must be taken during pcb assembly and soldering process to prevent damage to the led component. led component may be e?ectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. 1.59 mm esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105c max. C preheat time 60 sec max C peak temperature 250c max. 260c max. dwell time 3 sec max. 5 sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering pro?le to ensure that it is always conforming to recommended soldering conditions. note: 1. pcb with di?erent size and design (component density) will have di?erent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering pro?le again before loading a new type of pcb. 2. avago technologies high brightness led are using high e?ciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led con?guration note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. any alignment ?xture that is being applied during wave soldering should be loosely ?tted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment ?xture or pallet. if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using re?ow soldering prior to insertion the th led. recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause di?culty inserting the th led. refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. cathode
7 example of wave soldering temperature pro?le for th led ammo packs drawing 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. preheat temperature (c) 6.351.30 0.250.0512 cathode view a - a ? typ. 12.701.00 0.500.0394 20.51.00 0.80710.0394 4.000.20 0.15750.0079 0.700.20 0.2760.0079 12.700.30 0.500.0118 9.1250.625 0.35930.025 18.000.50 0.70870.0197 aa
8 packaging box for ammo packs note: the dimension for ammo pack is applicable for the device with stando? and without stando?. packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box) from left side of box adhesive tape must be facing upwards anode lead leaves the box first label on this side of box cathode ? + anode avago technologies mother label (1p) item: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id: deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 250c
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. av02-2258en - november 30, 2009 acronyms and de?nition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only (ii) avago baby label (only available on bulk packaging) (1p) part #: part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code rohs compliant e3 max tem p 250c lam p s bab y label disclaimer: avagos products and software are not speci?cally designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
|
